[Home]   [Full version]  

Industry's First 2-Gigabit DDR2 SDRAM

Sep 20 ,Electronic Devices



Full size image
Samsung Electronics Co., Ltd., the leader in advanced semiconductor technology, today announced the industry's first 2-Gigabit (Gb) DDR2 SDRAM utilizing 80-nanometer (nm) process technology. The high density, DDR2 solution will enhance server and workstation performance and enable faster deployment of memory intensive applications like real time video conference, remote medical service, two-way communications, and 3-D graphics.

Samsung developed the DDR2 SDRAM using an advanced 80nm process technology, overcoming the industry expectations that 2Gb DRAM manufacture would require sub 65nm circuitry.

The new DRAM technology breakthroughs include a 3-D transistor technology, recess channel array transistor (RCAT), and a new concept architecture process.

First introduced 2003, RCAT is a technology unique to Samsung that reduces transistor area space by implementing a 3-D structural design, increasing the integration level for higher density on a given area.

To address the high performance features of the DDR2 specification, Samsung adopted a double poly gate technology, 20-angstrom level ultra thin oxide film process, and a triple-layer metal circuitry. The high speed process technology coupled with the feasible 80nm technology also advances the time-to-market availability of the new DDR2 device.

Market research firm, Gartner Dataquest forecasts that DDR2 technology's market share will grow from 11 percent this year to 50 percent by year-end 2005, making DDR2 the mainstream DRAM product.

The company expects aggregate sales of DDR2 to reach 15million units in September and will continue to dedicate more of its DDR production to the high performance technology aiming for DDR2 to comprise 32% of its DDR business by years' end

Samsung plans to launch mass production of the 80nm process, 2Gb DDR2 SDRAM in the second half of 2005. The 2Gb DDR2 devices meet fine-pitch ball grid array (FBGA) package specifications for DDR2. Even without modifications, the devices can directly drive module density levels of Gigabyte (GB) scale; 2GB, 4GB and 8GB.

Related stories:

AMD Introduces Cutting-Edge PC Platform
Rewriting the rules for enthusiast computing, AMD today unveiled its new platform codenamed “Spider”, with the first true quad-core processor supporting scalable graphics for The Ultimate Visual Experience. The AMD Spider platform combines the introduction of AMD Phenom quad-core processors, ATI Radeon HD 3800 Series graphics processors with Microsoft DirectX 10.1 support, AMD 7-Series chipsets with CrossFireX and AMD OverDrive software. The AMD Spider platform is a major milestone on the path to Accelerated Computing, AMD’s vision for platform-level acceleration through co-processing.
Elpida Develops a 65nm-Process 1-Gigabit DDR2 SDRAM, World's Smallest Chip
Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM), announced today that it has completed development of a 1-Gigabit DDR2 SDRAM based on new 65nm process technology. The 65nm process allows Elpida to create the world's smallest chip products.
Elpida Introduces the World's Fastest DRAM Based on the Rambus XDR Memory Architecture
Elpida Memory, Japan's leading global supplier of Dynamic Random Access Memory (DRAM) and Rambus Inc., one of the world's premier technology licensing companies specializing in high-speed chip architectures, today introduced the industry's fastest DRAM, the 512 Megabit (Mb), 4.8GHz XDR DRAM, based on Rambus' XDR memory architecture.
Vendors Roll Out New Centrino Notebooks
HP, Lenovo and Gateway upgrade their laptops with Intel's latest mobile platform. Dell says it will wait.
HP Plans to Go Even More Mobile
Hewlett-Packard is offering a number of updated laptops, along with a new tablet, which are geared toward enterprise users and will be some of the first PCs to offer Intel's Centrino Pro platform.
Samsung Electronics Develops New, Highly Efficient Stacking Process for DRAM
Samsung Electronics today announced that it has developed the first all-DRAM stacked memory package using 'through silicon via' (TSV) technology, which will soon result in memory packages that are faster, smaller and consume less power.
Samsung Develops New, Highly Efficient Stacking Process for DRAM
Samsung Electronics today announced that it has developed the first all-DRAM stacked memory package using ‘through silicon via’ (TSV) technology, which will soon result in memory packages that are faster, smaller and consume less power.
Samsung Begins World's First 60nm-DRAM Mass Production
Samsung Electronics announced today that it has begun mass producing the industry’s first 1Gigabit (Gb) DDR2 DRAM (dynamic random access memory) using 60 nanometer (nm)–class process technology.

News discussion:

Electronic Devices news

[Home]   [Full version]