[Home]
[Full version]
High Voltage DTMOS Power MOSFET Using A Super Junction Structure To Reduce Power Consumption
Mar 29 ,Technology
Continuing its leadership role in developing innovative power semiconductors, Toshiba America Electronic Components, Inc. (TAEC) and its parent Toshiba Corp. announced a new power MOSFET called DTMOS, that employs a new super junction structure that enables a reduction in power consumption caused by on-state resistance (RDSON) to approximately 40 percent of the value typically achieved with conventional MOSFETs. Developed by Toshiba, the first device in the DTMOS family, TK15A60S, is targeted for use in power supplies in television sets, home appliances, AC adapters and ballast lighting. Toshiba began shipping samples of the new MOSFET today, and will begin production in April 2005.
The super junction structure, which has vertical paths to allow electrical current to flow through easily on a silicon substrate, realizes lower RDSON than the theoretical limit of silicon. By applying this super junction structure and optimizing the total device, the RDSON for the same area in Toshiba's DTMOS device achieves a 60 percent reduction and its gate charge (Qg) achieves a 40 percent reduction compared with Toshiba's conventional MOSFETs. Consequently, RDSON * Qg, a characteristic that is one important performance index for MOSFETs (in which smaller is better), is one-fourth the value of the company's conventional MOSFETs.
With this announcement, Toshiba is combining a super junction structure with the company's original Deep Trench MOSFET (DTMOS) technology. This is the first in the market using super junction structure combined with deep trench technology.
The first device in the family, designated TK15A60S , features maximum ratings of 15 Amp (A) and 600 volt (V) with on resistance of 0.3 Ohm and will begin sampling in March 2005.
"We're very pleased to introduce the first member of our DTMOS product line, targeted at achieving significant reductions in power consumption in the mainstream switch mode power supply and ballast lighting markets with a 600V, 15A device," said Brach Cox, business development manager, power devices, in Toshiba's Discrete Business Unit.
Background of the Development
Recently, reduction of power consumption and miniaturization of consumer electronics have been in strong demand, and consequently, lower RDSON in power MOSFETs has been a target to improve their power efficiency. In order to respond to the demand for lower power consumption, Toshiba is commercializing a new product utilizing DTMOS technology which can improve efficiency of power supplies. Toshiba succeeded in the development of DTMOS because of its broad repertoire of power MOSFET devices and development expertise and device technology.
Features
-- Due to the super junction structure, RDS ON reaches 0.3 Ohm (maximum).
-- At this time, Toshiba is the first to utilize a super junction structure with deep trench technology on a silicon substrate.
-- The device uses a TO-220SIS package, which is widely used in the market, and enables conventional products to be replaced easily.
Related stories:
Toshiba develops new MRAM device which opens the way to giga-bits capacity
Toshiba Corporation today announced important breakthroughs in key technologies for magnetoresistive random access memory (MRAM), a promising, next-generation semiconductor memory device.
Toshiba Announces Gallium Nitride Power FET with World's Highest Output Power in Ku-band
Toshiba Corporation today announced that it has developed a gallium nitride (GaN) power field effect transistor (FET) for the Ku-band (12GHz to 18GHz) frequency range that achieves an output power of 65.4W at 14.5GHz, the highest level of performance yet reported at this frequency band.
WinHEC: Day Two Wrapup
On day two we learned more about the Vista driver rollout, HomePlug networking, and the Windows Home Server product.
Nano-scale fuel cells may be closer than we think, thanks to an inexpensive new manufacturing method
We live in a world of hand-held devices: iPods, cell phones, PDAs, pagers... the list of essential personal technology keeps expanding, and the natural response is consolidation. It’s rare these days to see a new cell phone that isn’t also a digital camera, and MP3 players can be integrated into just about anything. We’re just a short step away from universal, hand-held devices that combine communication, media, and entertainment into one slim package. What’s stopping us? In a word,
power.
Toshiba Announces Gallium Nitride Power FET With World's Highest Power Output
Toshiba Corporation today announced development of a gallium nitride (GaN) power field effect transistor (FET) that far surpasses the operating performance of the gallium arsenide (GaAs) FET widely used in base stations for terrestrial and satellite microwave communications. The new transistor achieves output power of 174W at 6GHz, the highest level of performance yet reported at this frequency.
IBM, Sony and Toshiba Unveil Details of the Cell Microprocessor
IBM, Sony Group and Toshiba today announced the release of key documents that describe technical details of the revolutionary Cell Broadband Engine architecture. The documents are available at
http://www.ibm.com/developerworks/power/cell and
http://cell.scei.co.jp. Toshiba will release the documents once it completes its customer support structure.
Toshiba Develops High Performance Microprocessor Core
'MeP-h1'is the World's First 1GHz Configurable Processor
Toshiba Corporation announced that it has developed a new high-end processor core, MeP-h1, the first configurable microprocessor to achieve a 1GHz clock speed. The MeP-h1 is based on Toshiba's "Media embedded Processor" (MeP) architecture for digital consumer and other high performance SoCs. It gives designers the flexibility to customize processors at the design stage, including the ability to change processor configurations and add custom instructions to satisfy application requirements.
Toshiba Introduces L-Flat Rectifier Diode Packaging Designed To Save Space In Electronic Equipment
First Diodes in L-Flat series support current ratings up to 10 Amps while reducing mounting area by 50 percent
Toshiba America Electronic Components, Inc. today announced the availability of its new L-Flat surface mount packages for high-power rectifier diodes, which utilize a lead-clamp structure to reduce mounting area by 50 percent or more compared to currently available industry standard packaging. In addition, TAEC introduced an extensive line of L-Flat diodes, with average forward current (IF
AV) ratings from 3 to 10 amperes (A). The L-Flat series, developed by Toshiba Corp., includes a selection of general purpose diodes, fast recovery diodes, high efficiency diodes, Schottky Barrier Diodes and zener diodes.
[Home]
[Full version]