ARM To Drive Automotive Electronics For Information, Performance And Safety In Cars

AMI Semiconductor, and ARM today announced that AMIS has selected the ARM® architecture for a new range of programmable automotive electronics solutions. AMIS has licensed two ARM7™ family processors to develop industry-specific solutions that will help improve driver information, in-car entertainment, body electronics and passenger safety.

The intelligent, low-cost, high-performance ARM7TDMI® and ARM7TDMI-S™ microprocessors will enhance silicon solutions produced by AMIS, including high-voltage interfacing, low data rate wireless solutions, system-level integration and sensor interfaces used by Tier 1 automotive system suppliers worldwide.

Gartner Dataquest's estimates for the automotive semiconductor market in 2002 show a growth of 4.3 percent to US$13.1 billion. Much of the growth came from semiconductor applications including enhanced powertrain electronics like direct injection engine control units and anti-lock braking systems with an electronic stability program (ESP) or brake booster. Emerging applications that enjoyed healthy demand included airbag accelerometer sensors, rain sensors, ultrasonic parking sensors, telematics and yaw rate sensor integrated circuits (Gartner Dataquest, 'Production surge boots automotive semiconductor market', 17 July 2003).

The new ARM Powered® AMIS solutions will help suppliers and manufacturers improve engine control to meet environmental legislations as well as increase car safety and performance via enhanced powertrain electronics. The first ARM technology-based automotive solutions from AMIS are expected to be available in 2006.

"The ARM architecture overall provides the flexibility we need to create new solutions, and improve on existing ones, for a constantly changing market," said Tony Denayer, senior vice president, product development, AMIS. "The ARM7 family cores suit multiple technologies and can be adapted to specific application requirements, such as low power consumption, low radiation or emission, or they can be optimized for specific high-speed capabilities."

Cost, size and power benefits were other important factors when AMIS chose the ARM7 family. They will now be integrated into user specific integrated circuits (USICs) and application specific integrated circuits (ASICs) ) and application specific standard products (ASSPs) to create flexible system-on-chip (SoC) solutions combining mixed-signal and high-voltage functionality, complex digital circuitry and embedded microprocessors in a single chip.

In addition, the flexible nature of the ARM processors means they can be used in AMIS chips for other industrial applications, such as high-end circuit breakers for home safety, or even in aerospace and military applications.

"AMIS provides unparalleled manufacturing adaptability and dedication to its customers," said Wayne Lyons, global automotive segment manager, ARM. "The ARM architecture provides a robust standard, extensively supported by developers across the industry. This infrastructure will help protect AMI Semiconductor's current developments and provide greater re-use of the technology in the vehicle network, and beyond, to other industries."

The ARM7TDMI-S core will be used in AMI Semiconductor's 0.35µm, 0.25µm or 0.18µm I3T mixed-signal high-voltage solutions, and potentially in its field programmable gate arrays (FPGA) to ASIC conversion solution, XPressArray™.

Related stories:

Kidney transplant patients may benefit from going off of certain immunosuppressive drugs
Withdrawal of calcineurin inhibitors provides long-term health benefits and saves money
Withdrawing certain immunosuppressive drugs following kidney transplantation prolongs survival and saves money compared with keeping patients on these medications for life, according to a study appearing in the September 2008 issue of the Journal of the American Society Nephrology (JASN).
Simple solutions the best for pain in the neck
It might just be that the most effective solutions to a pain in the neck are the simplest. According to a University of Alberta-led task force assigned the job of finding the best way to take the sting out of neck pain, the often debilitating ailment's best treatment is still more closely associated with a loving spouse's neck rub than anything the advancements of modern medicine have to offer.
Team-based e-learning turns a new page
How do students, who may be located across the globe, collaborate together on team-based project work? European researchers have developed the first online platform that integrates elements of e-learning, social networking and project management to help virtual teams get the most from their practical experience. How do you like to learn? Do you listen to a lecture and take notes, or would you prefer visual diagrams, pictures and handouts?
New laser technique promises better process control in the pharmaceutical industry
Scientists at the Science and Technology Facilities Council (STFC) Rutherford Appleton Laboratory in Oxfordshire, UK have developed an effective laser based method for the characterisation of the bulk chemical content of pharmaceutical capsules - without opening the capsules!
A 'gizmo' that saves lives
When Javier Rodriguez Molina visited the Atocha Train Station Memorial in Madrid last summer, the Barcelona native felt a great sadness for the victims of the 11 March 2004 Madrid train bombings. But he also felt some hope that his advanced emergency technology work at University of California, San Diego can some day save lives in similar disasters.
UMC, ARM Partner to Deliver Comprehensive SOI Solutions for 65nm Technology
UMC and ARM today announced that a test chip built with ARM SOI (Silicon On Insulator) libraries was taped-out successfully on UMC's 65-nanometer (nm) SOI process. The test chip consists of a set of ARM physical IP that uses a standard cell library, an I/O library and a single-port SRAM memory compiler. This tape-out at UMC represents the next step towards mainstream adoption of nanometer SOI technology for improved speed and power in complex system on chips (SOCs).
HANA Living-Room Network Spec Due This Year
On Maui, the 68-mile Hana highway often takes several hours to complete. The road toward the HANA home-networking spec appears just as grueling. The promise? Just one remote control. Really.
New Oxford spin-out to transform surfaces
The latest spin-out company from the University of Oxford, Oxford Advanced Surfaces Ltd, plans to apply surface science to develop a revolutionary coating for materials like plastics and Teflon.

News discussion:

Technology news